John H Lau | Bookhype

John H. Lau, Ph.D., P.E., IEEE Fellow, ASME Fellow is a senior engineer in the microsystems, modules, and components laboratory at the Institute of Microelectronics(IME) in Singapore.

Cheng Kuo Lee is at the National University of Singapore.

C. S. Premachandran is at the Institute of Microelectronics in Singapore.

Yu Aibin is at the Institute of Microelectronics in Singapore.

May 18, 2021

Cover of Semiconductor Advanced Packaging

Semiconductor Advanced Packaging

May 30, 2020

Cover of Assembly and Reliability of Lead-Free Solder Joints

Assembly and Reliability of Lead-Free Solder Joints

Apr 12, 2019

Cover of Heterogeneous Integrations

Heterogeneous Integrations

Apr 13, 2018

Cover of Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging

Jan 1, 2010

Cover of Reliability of Rohs-Compliant 2D and 3D IC Interconnects

Reliability of Rohs-Compliant 2D and 3D IC Interconnects (Electronic Engineering)

Jan 1, 2009

Cover of Advanced Mems Packaging

Advanced Mems Packaging

Jan 1, 2001

Cover of Microvias: For Low Cost, High Density Interconnects

Microvias: For Low Cost, High Density Interconnects

Jan 1, 2001

Cover of Microvias

Feb 8, 2000

Cover of Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies

Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies

Feb 28, 1999

Cover of CHIP SCALE PACKAGE, CSP

CHIP SCALE PACKAGE, CSP

Feb 1, 1998

Cover of Electronic Packaging

Electronic Packaging

Jun 30, 1994

Cover of Chip On Board

Jan 31, 1994

Cover of Mechanics of Solder Alloy Interconnects

Mechanics of Solder Alloy Interconnects

Oct 1993

Cover of The Handbook of Fine Pitch Surface Mount Technology

The Handbook of Fine Pitch Surface Mount Technology

Jan 31, 1992

Cover of Handbook Of Tape Automated Bonding

Handbook Of Tape Automated Bonding

May 31, 1991

Cover of Solder Joint Reliability

Solder Joint Reliability