"Low-Cost Flip Chip Technologies: For DCA, WLCSP, and PBGA Assemblies", by John H. Lau, is the first comprehensive and in-depth guide to low-cost flip chip technologies. This reference gives you cutting edge information on the most important new developments and latest research results in applying flip chip technologies to direct chip attach (DCA) - also called flip chip on board (FCOB), wafer level chip scale package (WLCSP), and plastic ball grid array (PBGA) package assemblies. For professionals active in flip chip research and development, those who wish to master flip chip problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in all aspects of this fascinating field. This one-stop guide meets the reference needs of engineers in the fields of design, materials, process, equipment, manufacturing, quality control, product assurance, reliability, component, packaging, marketing, and systems design, and technical managers working in electronic packaging and interconnection.
With this book you will develop a practical understanding of the economic, design, materials, process, equipment, quality, manufacturing, and reliability issues of low-cost flip chip technologies. Among the topics explored are: IC trends and packaging technology updates; more than 12 different wafer-bumping methods; more than 100 lead-free solder alloys; sequential build up PCB with microvias and via-in-pad; FCOB with anisotropic conductive film (ACF); FCOB with anisotropic conductive adhesive(ACA); solder-bumped FCOB with conventional underfills; solder-bumped FCOB with no-flow underfills; solder-bumped FCOB with imperfect underfills; physical and mechanical properties of underfills; how to select underfill materials; thermal management of solder-bumped FCOB; reliability of solder-bumped FCOB; failure analysis of solder-bumped FCOB; design, materials, process, and reliability of WLCSPs; solder-bumped flip chip in PBGA packages; fracture mechanics analysis of delaminations; and creep analysis of solder joints. Low-cost flip chip technology is taking the electronics industry by storm.
Page after page, this standard-setting guide gives you both essential technical details and an eye-opening overview of this fast-developing field. No matter how you use "Low-Cost Flip Chip Technologies For DCA, WLCSP, and PBGA Assemblies", you'll see why it's the resource of choice for those who want to be at the top of the game.
- ISBN10 0071351418
- ISBN13 9780071351416
- Publish Date 8 February 2000
- Publish Status Out of Stock
- Out of Print 12 October 2009
- Publish Country US
- Publisher McGraw-Hill Education - Europe
- Imprint McGraw-Hill Inc.,US
- Format Hardcover
- Pages 585
- Language English