Intended to be an electronic packaging resource, this text features writing from four leaders in the the four intertwined disciplines of packaging. Recent technological advances are discussed, including BGA, Flip Chip and CSP.
- ISBN10 0070371350
- ISBN13 9780070371354
- Publish Date 1 February 1998
- Publish Status Active
- Out of Print 5 April 2008
- Publish Country US
- Publisher McGraw-Hill Education - Europe
- Imprint McGraw-Hill Inc.,US
- Format Hardcover
- Pages 496
- Language English