Microvias: For Low Cost, High Density Interconnects

by John H Lau and Ricky S Lee

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  • ISBN10 6610913366
  • ISBN13 9786610913367
  • Publish Date 1 January 2001
  • Publish Status Active
  • Out of Print 18 May 2011
  • Publish Country US
  • Imprint McGraw-Hill Companies
  • Format eBook
  • Language English