Reliability of Rohs-Compliant 2D and 3D IC Interconnects (Electronic Engineering)

by John H Lau

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  • ISBN10 1282953362
  • ISBN13 9781282953369
  • Publish Date 1 January 2010
  • Publish Status Active
  • Out of Print 17 February 2015
  • Publish Country US
  • Imprint McGraw-Hill Professional Publishing
  • Format eBook
  • Language English