Microelectronic Yield, Reliability, and Advanced Packaging (Proceedings of SPIE, v. 4229)

by Cher Ming Tan, Yeng-Kaung Peng, Mali Mahalingam, and Krishnamachar Prasad

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  • ISBN10 0819439010
  • ISBN13 9780819439017
  • Publish Date 31 March 2001
  • Publish Status Active
  • Publish Country US
  • Imprint SPIE Press
  • Edition New ed.
  • Format Paperback
  • Pages 240
  • Language English