Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.
- ISBN13 9780081025321
- Publish Date 15 November 2019
- Publish Status Active
- Publish Country GB
- Publisher Elsevier Science & Technology
- Imprint Woodhead Publishing Ltd
- Format Paperback
- Pages 434
- Language English