Dr. Tingyu Lin is a technical Director of National Centre for Advanced Packaging (NCAP), China. He has more than 20-year experiences in design, process, assembly, reliability and equipment development in electronics packaging, semiconductor, consumer electronics, thermal and aerospace industry. Before joining NCAP, he was a Motorola (Google) certified Six Sigma Black Belt in 2012. From 2012-2013, he was a program director of Institute of Microelectronics, Singapore (IME), and responsible for 2.5D, fan-out and WLP development. From 1997-2012, he worked as a senior manager in Philips, Lucent Technologies (previous AT &T Bell Lab) and Motorola Electronics, respectively, and responsible for consumer electronics design, process and product development, and advanced manufacturing in advanced IC packaging in flip chip module and SiP, and supply chain management and mobile product quality and reliability improvement. Until now, he has been engaged in more than 100 product design & process development in mobile modules, IC components, and consumer electronics, etc. He has published 150 papers and filed more than 10 patents, and obtained many best paper awards. He has led two international ASTM standards for TSV development and received the Motorola Innovation award in 2008.
