Dr. Faxing Che is a scientist with the Institute of Microelectronics (IME), Agency for Science, Technology and Research (A-star), Singapore. He has 13-years' experience in the design-for-reliability for advanced electronics packaging. He was a Senior R&D Engineer with the United Test and Assembly Centre and ST Microelectronics for three years, and a Staff Engineer with Infineon Technologies Singapore for two years. He has authored and co-authored more than 120 technical papers in refereed journals and conferences. His current research interests include design for reliability in wafer-level, chip scale packaging, and 3-D advanced packaging, Cu wire bonding, Fan-out WLP, finite-element modeling and characterization of microelectronics packaging materials.
