Dr. Hengyun Zhang is a professor in Shanghai University of Engineering Science. He has worked in industry and research institutes for 16 years, including Institute of Microelectronics (Singapore), Advanced Micro Devices and Dow Corning. He was the recipient of the Best Poster Paper award from ITHERM 2004, AMD Engineering Excellence Award 2008, and Best Paper award from Icept 2010. He has nearly 70 publications in international journals and conferences, and more than 24 patents granted/filed of thermal and packaging significance. He also served in a number of international conferences as a committee member (ITHERM, ICEPT, EPTC, MNHMT etc). He was a speaker in IME Industry Forums on thermal packaging and the project leader for more than ten research projects. His current interests include thermal management and electronics packaging.
