The European Union's directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.
- ISBN10 0387388923
- ISBN13 9780387388922
- Publish Date December 2007 (first published 1 January 2007)
- Publish Status Active
- Publish Country US
- Imprint Springer-Verlag New York Inc.
- Format eBook
- Pages 368
- Language English