Advanced Routing of Electronic Modules (Electronic Packaging, #2)

by Michael Pecht and Yeun Tsun Wong

James P. Cohoon, Michael Pecht, Joseph L. Ganley, Kaushik Roy, Paul Molitor, Yu-Chin Hsu, Manuela Raith, Enrico Malavasi, and Hyunchul Shin

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Book cover for Advanced Routing of Electronic Modules

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The rapid growth of the electronic products market has created an increasing need for affordable, reliable, high-speed and high-density multi-layer printed circuit boards (PCBs). This book presents the technologies, algorithms, and methodologies for engineers and others developing the next generation of electronic products.
A vision of the future in advanced electronics
Advanced Routing of Electronic Modules provides both fundamental theory and advanced technologies for improving routing. Beginning chapters discuss approaches to approximate a minimum rectilinear Steiner tree from a minimum spanning tree and introduce ways to avoid obstacles for routing simple multi-terminal nets sequentially in a workspace. Timing delay, clock skew, and noise control requirements in signal integrity are described as well as computer-aided approaches to managing these requirements in high-speed PCB/MCM routing.
Later chapters present the two-layer wiring problem, rip-up and reroute approaches, and parallel routing, including global routing, boundary crossing placement, and detailed maze routing in hardware acceleration. Data structures, data management, and algorithms for parallel routing in a multiple-processor hardware systems are also covered.

  • ISBN10 0849396220
  • ISBN13 9780849396229
  • Publish Date 23 October 1995
  • Publish Status Active
  • Publish Country US
  • Publisher Taylor & Francis Inc
  • Imprint CRC Press Inc
  • Format Hardcover
  • Pages 480
  • Language English