Recent and radically improved machining processes, from high wheel speeds to nanotechnology, have turned a spotlight on abrasive machining processes as a fertile area for further advancements. Written for researchers, students, engineers and technicians in manufacturing, this book presents a fundamental rethinking of important tribological elements of abrasive machining processes and their effects on process efficiency and product quality. Newer processes such as chemical mechanical polishing (CMP) and silicon wafer dicing can be better understood as tribological processes. Understanding the tribological principles of abrasive processes is crucial to discovering improvements in accuracy, production rate, and surface quality of products spanning all industries, from machine parts to ball bearings to contact lens to semiconductors.
- ISBN10 661202769X
- ISBN13 9786612027697
- Publish Date 31 December 2004 (first published 1 January 2004)
- Publish Status Active
- Out of Print 9 March 2011
- Publish Country US
- Imprint Elsevier Science & Technology
- Format eBook
- Pages 751
- Language English