Series:

SpringerBriefs in Thermal Engineering and Applied Science

8 total works

Cover of Introduction to Enhanced Heat Transfer

This Brief stands as a primer for heat transfer fundamentals in heat transfer enhancement devices, the definition of heat transfer area, passive and active enhancement techniques and their potential and benefits and commercial applications. It further examines techniques and modes of heat transfer like single-phase flow and two-phase flow, natural and forced convection, radiation heat transfer and convective mass transfer.

Cover of Critical Heat Flux in Flow Boiling in Microchannels
This Brief concerns the important problem of critical heat flux in flow boiling in microchannels. A companion edition in the SpringerBrief Subseries on Thermal Engineering and Applied Science to "Heat Transfer and Pressure Drop in Flow Boiling in Microchannels," by the same author team, this volume is idea for professionals, researchers, and graduate students concerned with electronic cooling.

Cover of Heat Transfer and Pressure Drop in Flow Boiling in Microchannels
This Brief addresses the phenomena of heat transfer and pressure drop in flow boiling in micro channels occurring in high heat flux electronic cooling. A companion edition in the Springer Brief Subseries on Thermal Engineering and Applied Science to “Critical Heat Flux in Flow Boiling in Micro channels,” by the same author team, this volume is idea for professionals, researchers and graduate students concerned with electronic cooling.

Cover of Insert Devices and Integral Roughness in Heat Transfer Enhancement

This Brief describes heat transfer and pressure drop in heat transfer enhancement by insert devices and integral roughness. The authors deal with twisted-tape insert laminar and turbulent flow in tubes and annuli in smooth tubes and rough tubes, segmented twisted-tape inserts, displaced enhancement devices, wire coil inserts, extended surface inserts and tangential injection devices. The articles also address transverse and helical integral rib roughness, corrugated tube roughness, 3D and 2D roughness, rod bundles, outside roughness for cross flow, non-circular channels, Reynolds analogy and similarity law, numerical simulation and predictive models. The book is ideal for professionals and researchers working with thermal management in devices.

 

Cover of Heat Transfer Enhancement in Plate and Fin Extended Surfaces

This Brief deals with heat transfer and friction in plate and fin extended heat transfer enhancement surfaces. It examines Offset-Strip Fin (OSF), Enhancement Principle, Analytically Based Models for j and f vs. Re, Transition from Laminar to Turbulent Region, Correlations for j and f vs. Re, Use of OSF with Liquids, Effect of Percent Fin Offset, Effect of Burred Edges, Louver fin, heat transfer and friction correlations, flow structure in the louver fin array, analytical model for heat transfer and friction, convex louver fin, wavy fin, 3D corrugated fin, perforated fin, pin fins and wire mesh, types of vortex generators, metal foam fin, plain fin, packings, numerical simulation of various types of fins.

Cover of Electric Fields, Additives and Simultaneous Heat and Mass Transfer in Heat Transfer Enhancement
This Brief deals with electrode design and placement, enhancement of both liquid and gas flow, vapor space condensation, in-tube condensation, falling film evaporation, correlations. It further provides a fundamental understanding of boiling and condensation, pool boiling, critical heat flux, convective vaporization, additives for single-phase liquids like solid particles, gas bubbles, suspensions in dilute polymer and surfactant solutions, solid additives and liquid additives for gases, additives for boiling, condensation and absorption, mass transfer resistance in gas phase (condensation with noncondensible gases, evaporation into air, dehumidifying finned tube heat exchangers, water film enhancement of finned tube exchanger), controlling resistance in liquid phase, and significant resistance in both phases. The volume is ideal for professionals and researchers dealing with thermal management in devices.

Cover of Performance Evaluation Criteria in Heat Transfer Enhancement
This Brief deals with Performance Evaluation Criteria (PEC) for heat exchangers, single phase flow, objective function and constraints, algebraic formulation, constant flow rate, fixed flow area, thermal resistance, heat exchanger effectiveness, relations for St and f, finned tube banks, variations of PEC, reduced exchanger flow rate, exergy based PEC, PEC for two-phase heat exchangers, work consuming, work producing and heat actuated systems. The authors explain Performance Criteria of Enhanced Heat Transfer Surfaces-the ratio of enhanced performance to the basic performance-and its importance for Heat Transfer Enhancement and efficient thermal management in devices.

Cover of Instability in Flow Boiling in Microchannels
This Brief addresses the phenomena of instability in flow boiling in microchannels occurring in high heat flux electronic cooling. A companion edition in the SpringerBrief Subseries on Thermal Engineering and Applied Science to “Critical Heat Flux in Flow Boiling in Microchannels,” and "Heat Transfer and Pressure Drop in Flow Boiling in Microchannels,"by the same author team, this volume is idea for professionals, researchers, and graduate students concerned with electronic cooling.