This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device.
- ISBN13 9789811931314
- Publish Date 8 August 2022
- Publish Status Forthcoming
- Publish Country SG
- Imprint Springer Verlag, Singapore
- Edition 1st ed. 2022
- Format Hardcover
- Pages 172
- Language English