This is the first book to summarize the core principles and practical applications of a novel, advanced chip-cooling category: liquid-metal cooling. It describes the science and implementation of room- temperature liquid-metal enabled cooling for chips, devices and systems. It outlines the basic features of liquid-metal-based enhanced heat transfer and offers an overview of selected fundamental and practical issues. Lastly, it explains the key mechanisms behind these next-generation advanced cooling approaches, and proposes future research directions.
Discussing major breakthrough features, unique scientific and practical merits, and intriguing liquid metal coolant or medium behaviors in connection with powerful next-generation cooling systems, the book appeal to a broad readership. Further, the combination of key fundamental and practical aspects offers inspiration for researchers looking for new ways of making advanced cooling systems to meet the increasingly pressing needs of today's highly integrated chip industry.
- ISBN13 9789811359217
- Publish Date 11 December 2019
- Publish Status Cancelled
- Publish Country SG
- Imprint Springer Verlag, Singapore
- Edition 1st ed. 2019
- Format Hardcover
- Language English