Quality Inspection and Reliability Study of Solder Bumps in Packaged Electronic Devices: Using Laser Ultrasound and Finite Element Methods

by Jin Yang

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  • ISBN10 1243589701
  • ISBN13 9781243589705
  • Publish Date 1 September 2011
  • Publish Status Unknown
  • Publish Country US
  • Imprint Proquest, Umi Dissertation Publishing
  • Format Paperback (US Trade)
  • Pages 298
  • Language English