Plastic Encapsulation of Microelectronics: Materials, Processes, Quality, Reliability and Applications

by Michael Pecht

0 ratings • 0 reviews • 0 shelved
Book cover for Plastic Encapsulation of Microelectronics

Bookhype may earn a small commission from qualifying purchases. Full disclosure.

This study addresses issues relevant to PEM devices and the assemblies that incorporate PEMs, including materials, processes, screens, tests, failure mechanisms, reliability and the applications of PEMs that may be specific to environmental conditions. The text documents existing research and supports all activities that are currently underway throughout the world to establish the universal applicability of PEMs.
  • ISBN10 0471306258
  • ISBN13 9780471306252
  • Publish Date 20 February 1995
  • Publish Status Out of Stock
  • Out of Print 12 December 2001
  • Publish Country US
  • Imprint John Wiley & Sons Inc
  • Format Hardcover
  • Pages 350
  • Language English