Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.
The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.
The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.
- ISBN13 9781845695286
- Publish Date 22 May 2015 (first published 1 January 2015)
- Publish Status Active
- Publish Country GB
- Publisher Elsevier Science & Technology
- Imprint Woodhead Publishing Ltd
- Format Hardcover
- Pages 482
- Language English