Area Array Packaging Processes

by Ken Gilleo

0 ratings • 0 reviews • 0 shelved
Book cover for Area Array Packaging Processes

Bookhype may earn a small commission from qualifying purchases. Full disclosure.

This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.
  • ISBN10 0071738010
  • ISBN13 9780071738019
  • Publish Date 23 October 2003
  • Publish Status Active
  • Publish Country US
  • Publisher McGraw-Hill Education - Europe
  • Imprint McGraw-Hill Professional
  • Format Paperback (US Trade)
  • Pages 272
  • Language English