Tribology in Chemical-Mechanical Planarization

by MR David Craven and Hong Liang

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The role that friction and contact play in the processes of wear and planarization on material surfaces is central to the understanding of Chemical-Mechanical planarization (CMP) technology, particularly when applied to nanosurfaces. Tribology in Chemical-Mechanical Planarization presents a detailed account of the CMP process in a language that is
  • ISBN10 6610516782
  • ISBN13 9786610516780
  • Publish Date 1 March 2005 (first published 1 January 2005)
  • Publish Status Active
  • Out of Print 21 August 2012
  • Publish Country US
  • Publisher Taylor & Francis Ltd
  • Imprint CRC Press
  • Format eBook
  • Pages 198
  • Language English