Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
- ISBN10 0387782192
- ISBN13 9780387782195
- Publish Date 1 January 2009
- Publish Status Active
- Publish Country US
- Imprint Springer-Verlag New York Inc.
- Format eBook
- Language English