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A rigorous and thorough introduction to electronic packaging technologies
The only book to teach microsystems packaging--written by the field's leading authorThis is the book that engineers, technicians, and students want—the first to teach microsystems packaging from the ground up. Rao Tummala’s one-stop Fundamentals to Microsystems Packaging covers the field from wafer to systems, including every major contributing technology. It’s the only book to do so. This much-needed tool features:
*A comprehensive tutorial covering every major aspect of microelectronics, photonics, RF, packaging design, assembly, reliability, testing, manufacturing and its relevance to both semiconductors and systems.
*Rigorous coverage of electrical, mechanical, chemical, and materials aspects of each technology
*Easy-to-read schematics and block diagrams
*Fundamental approaches to all system issues
*Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others
*Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes
*Basics of electrical and reliability testing
*Hundreds of explanatory two-color illustrations
*Self-test problems and solutions in every chapter
*Glossary
*The best way to learn microsystems packaging through self-study or in a classroom—and the most comprehensive on-the-job referenceMICROSystems PACKAGINGFROM THE GROUND UP
- ISBN13 9780071371698
- Publish Date 16 June 2001 (first published 8 May 2001)
- Publish Status Out of Stock
- Out of Print 12 March 2021
- Publish Country US
- Publisher McGraw-Hill Education - Europe
- Imprint McGraw-Hill Professional
- Format Hardcover
- Pages 967
- Language English