Failure Modes and Mechanisms in Electronic Packages

by P. Singh and Puligandla Viswanadham

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With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.

  • ISBN13 9781461377634
  • Publish Date 24 October 2012 (first published 30 November 1997)
  • Publish Status Active
  • Publish Country US
  • Imprint Springer-Verlag New York Inc.
  • Edition Softcover reprint of the original 1st ed. 1998
  • Format Paperback
  • Pages 370
  • Language English