The classic sourcebook for designing and evaluating wire bonds engineered with the latest metallurgies completely updatedWire bonding is the attachment of fine wires from semiconductor chips to their substrates—a connection that is vital to the success of ever-shrinking consumer electronic devices, such as iPODs. Long-established as the industry standard, this book has been completely revised and expanded to cover wire bonding advances for the era of super-small electronics.
Wire Bonding in Microelectronics, Third Edition, equips you with everything needed to design and evaluate wire bonds engineered with cutting-edge metallurgies. The Third Edition provides full details and step-by-step instructions for engineering reliable bonds at a very high yield. The author presents up-to-the-minute information on utilizing fine-pitch wire bonds, low-looping bonds, wafer-level bumping,
- ISBN13 9780071701013
- Publish Date 16 March 2010
- Publish Status Out of Stock
- Out of Print 9 December 2009
- Publish Country US
- Publisher McGraw-Hill Education - Europe
- Imprint McGraw-Hill Professional
- Edition 3rd edition
- Format Hardcover
- Language English