This book covers area array packaging at the cutting-edge. This is the first book to bring BGA, CSP, and Flip Chip together - teaching design, application, and manufacturing how-tos. As pagers, cell phones, and other portable electronics shrink while demand for features and functions grows, the need for better, faster, smaller, cooler high-density interconnects (HDI) becomes more critical. "The Area Array Packaging Handbook" brings you the details you need on this rapidly expanding field in microelectronics packaging.Filled with hands-on, leading edge information engineers need for day-to-day decision making, "Area Array Packaging Handbook" is an unbeatable resource for success in today's fast-paced world of HDI.
Look for these highlights inside: the hottest technologies in electronics packaging - BGA, CSP, and Flip Chip - all in one reference; details on MEMs technology; pros and cons of each technology in various applications; solutions for difficult packaging ramifications of HDI design concepts; detailed coverage of critical reliability and testing issues; help with design, materials, and manufacturing processes; problem-solving approaches to conception, construction, assembly, and applications; world-class expert contributors; and, 400 illustrations. It covers advances, applications, concepts, design, economics, opimization, equipment, future, technology, materials, processes, and productivity.
- ISBN10 0071500650
- ISBN13 9780071500654
- Publish Date 26 November 2001
- Publish Status Active
- Publish Country US
- Imprint McGraw-Hill Education
- Format eBook
- Pages 1000
- Language English