Microvias: For Low Cost, High Density Interconnects

by Dr John H Lau and Ricky S W Lee

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  • ISBN10 0071382992
  • ISBN13 9780071382991
  • Publish Date 21 May 2001
  • Publish Status Active
  • Publish Country US
  • Imprint McGraw-Hill Education
  • Format eBook
  • Pages 550
  • Language English