Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability

by Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, and Hongtao Ma

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This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

  • ISBN13 9781461492658
  • Publish Date 6 November 2014 (first published 1 January 2014)
  • Publish Status Active
  • Publish Country US
  • Imprint Springer-Verlag New York Inc.
  • Edition 2015 ed.
  • Format Hardcover
  • Pages 253
  • Language English