In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
- ISBN13 9781000219081
- Publish Date 19 April 2016 (first published 1 January 2011)
- Publish Status Withdrawn
- Publish Country GB
- Publisher Taylor & Francis Ltd
- Imprint CRC Press
- Format eBook
- Pages 216
- Language English