Packaging of High Power Semiconductor Lasers (Micro- and Opto-Electronic Materials, Structures, and Systems)

by Xingsheng Liu, Professor Wei Zhao, and Lingling Xiong

0 ratings • 0 reviews • 0 shelved
Book cover for Packaging of High Power Semiconductor Lasers
Shelve It

Bookhype may earn a small commission from qualifying purchases. Full disclosure.

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
  • ISBN10 1461492645
  • ISBN13 9781461492641
  • Publish Date 31 July 2014 (first published 15 July 2014)
  • Publish Status Withdrawn
  • Out of Print 18 October 2014
  • Publish Country US
  • Imprint Springer
  • Format Paperback (US Trade)
  • Pages 420
  • Language English