This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization.
Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.
- ISBN10 1598292455
- ISBN13 9781598292459
- Publish Date 1 December 2007 (first published 1 November 2007)
- Publish Status Temporarily Withdrawn
- Imprint Morgan & Claypool
- Format eBook
- Pages 108
- Language English