Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. Without careful attention to these additional issues, it is not possible to successfully engineer electronic packaging at these frequencies. This resource presents the packaging issues which are unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques and how they can be tailored or analysed for higher frequency designs. The book's chapters are organised in logical groups and contain 30 different practical examples.
- ISBN10 1608076989
- ISBN13 9781608076987
- Publish Date 1 December 2013
- Publish Status Active
- Publish Country US
- Imprint Artech House Publishers
- Format eBook
- Language English