Loose Leaf Engineering Circuit Analysis

by William H. Hayt, Jack Kemmerly, and Steven M Durbin

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Book cover for Loose Leaf Engineering Circuit Analysis

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  • ISBN10 0077753623
  • ISBN13 9780077753627
  • Publish Date 7 August 2012
  • Publish Status Out of Print
  • Out of Print 10 April 2021
  • Publish Country US
  • Imprint McGraw-Hill Education
  • Edition 8th ed.
  • Format Paperback
  • Language English