2013 Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2013): Volume 2

by American Society of Mechanical Engineers

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Book cover for 2013 Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2013): Volume 2

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Focuses on R&D, manufacturing, and application for packaging and integration of electronic and photonic systems, MEMS, and NEMS, the proceedings cover the latest research and emerging technologies.

Printed collection on 80 full-length, peer-reviewed technical papers. Topics include:
  • Thermal Management
  • Data Centers and Energy Efficient Electronic Systems
  • ISBN13 9780791855768
  • Publish Date 30 December 2013
  • Publish Status Active
  • Publish Country US
  • Imprint American Society of Mechanical Engineers,U.S.
  • Format Paperback
  • Pages 680
  • Language English