Focuses on R&D, manufacturing, and application for packaging and integration of electronic and photonic systems, MEMS, and NEMS, the proceedings cover the latest research and emerging technologies.
Printed collection on 86 full-length, peer-reviewed technical papers. Topics include:
- Advanced Packaging
- Emerging Technologies
- Modeling and Simulation
- Multi-Physics Based Reliability
- MEMS and NEMS
- Materials and Processes
- ISBN13 9780791855751
- Publish Date 30 December 2013
- Publish Status Active
- Publish Country US
- Imprint American Society of Mechanical Engineers,U.S.
- Format Paperback
- Pages 768
- Language English