Integrated Ultra High Density Multi-Chip Module Packaging Design

by Jeffrey Thompson

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  • ISBN10 1248970225
  • ISBN13 9781248970225
  • Publish Date 1 May 2012
  • Publish Status Unknown
  • Publish Country US
  • Imprint Proquest, Umi Dissertation Publishing
  • Format Paperback (US Trade)
  • Pages 120
  • Language English