Microvias: For Low Cost, High Density Interconnects

by John H Lau and Ricky S Lee

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  • ISBN10 1280913363
  • ISBN13 9781280913365
  • Publish Date 1 January 2001
  • Publish Status Active
  • Out of Print 17 February 2015
  • Publish Country US
  • Imprint McGraw-Hill Companies
  • Format eBook
  • Pages 565
  • Language English