Developments over the past six years have been covered in this expanded text, while previously covered topics have been revisited with a fresh perspective. New material includes fault isolation and characterization, as well as state-of-the-art techniques to analyze the die from the backside. This updated reference book, prepared by experts in their fields, contains 60 articles covering a wide range of topics involving the failure analysis of microelectronics. It places the most frequently needed information on this subject at your fingertips. Contents: Overall View of Failure Analysis of Microelectronic Devices Test-and-Fail Verification Decapsulation and Package Analysis Electrical Techniques Electron/ Ion-Beam Based Techniques Thermal Techniques Photonic Techniques Soft-ware Techniques Deprocessing and Sample Preparation Physical / Chemical Defect Characterization Discrete / Passive Component Analysis Failure Modes and Mechanisms Advance Techniques Laboratory Operations and Management.
- ISBN10 0871706385
- ISBN13 9780871706386
- Publish Date 1 October 2002
- Publish Status Unknown
- Publish Country US
- Imprint ASM International
- Edition 4th Revised edition
- Format Hardcover
- Pages 644
- Language English