Formerly interim VP of Technology at Emerson (and previously Chief Engineer, Chairman of the CAE Committee, R&D Manager, and Principal Mechanical Engineer). Has also worked as Plastics Engineer, Engineering Manager and Materials Scientist at Celanese in their R. L. Mitchell Technical Center in Summit, New Jersey, USA. He developed new products for the aerospace & defence, automotive, medical, electrical and consumer products sectors while heading engineering for Aegis in Sydney, Australia. He has introduced a new product development methodology for creating Emerson's Electrical Enclosures enabling decreased manufacturing costs by 35% while increased value to customers resulting in doubling this business within 18 months. He integrated plastic flow, stress, vibration and thermal analysis with 3D CAD/CAM system thereby reducing design cycle (art-to-part) to 26 weeks. He established centre of excellence to create testing procedures for incoming polymer inspection (SPC, SQC) by implementing physical and thermal characterization of materials. He directed development of several proprietary electronics potting and encapsulations. He conceived and designed fully automatic coil manufacturing line with new coil winding equipment, precision stamping, robotic assembly, blow moulding, vertical insert injection moulding, marking, testing, and fully automatic packaging to increase productivity and thereby eliminate job losses to low cost countries.
