Michael G Pecht | Bookhype

May 1, 2018

Cover of Risk-Based Engineering

Risk-Based Engineering (Springer Series in Reliability Engineering)

Sep 20, 2013

Cover of Copper Wire Bonding

Copper Wire Bonding

Jan 1, 2012

Cover of Strategies to the Prediction, Mitigation and Management of Product Obsolescence

Strategies to the Prediction, Mitigation and Management of Product Obsolescence (Wiley Series in Systems Engineering and Management, #87)

Jan 1, 2008

Cover of Prognostics and Health Management of Electronics

Prognostics and Health Management of Electronics

Dec 31, 2006

Cover of China's Electronics Industry

China's Electronics Industry

Jan 1, 2006

Cover of Lead-Free Electronics

Lead-Free Electronics

Jan 1, 2002

Cover of Contamination of Electronic Assemblies

Contamination of Electronic Assemblies

Dec 18, 1998

Cover of Electronic Packaging Materials and Their Properties

Electronic Packaging Materials and Their Properties (Electronic Packaging)

Apr 24, 1997

Cover of Influence of Temperature on Microelectronics and System Reliability

Influence of Temperature on Microelectronics and System Reliability