Semiconductor Packaging - A Multidisciplinary Approach

by Robert J. Hanneman and etc.

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The creation of successful and reliable electronic products involves the interaction of electrical, mechanical, materials, and reliability engineering. This book covers all the physical systems, processes, and materials that a packaging engineer must confront and provides all the tools necessary to overcome a wide range of issues and problems. Features comprehensive, multidisciplinary, and up-to-date coverage. Includes copious reference data, graphs, tables and figures.
  • ISBN10 0471181234
  • ISBN13 9780471181231
  • Publish Date 1 April 1997
  • Publish Status Out of Stock
  • Out of Print 14 May 2003
  • Publish Country US
  • Imprint John Wiley & Sons Inc
  • Format Paperback
  • Pages 896
  • Language English