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System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where "systems" used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
- ISBN10 6611332995
- ISBN13 9786611332990
- Publish Date 15 April 2008 (first published 22 July 2007)
- Publish Status Active
- Out of Print 14 September 2011
- Publish Country US
- Imprint McGraw-Hill Companies
- Format eBook
- Pages 785
- Language English