Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging Research (Wspc Series In Advanced Integration And Packaging, #3)

Karl J L Geisler (Editor), Madhusudan Iyengar (Editor), and Bahgat G Sammakia (Editor)

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To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.
  • ISBN13 9789814579780
  • Publish Date 23 October 2014 (first published 1 January 2014)
  • Publish Status Active
  • Publish Country SG
  • Imprint World Scientific Publishing Co Pte Ltd