Wiley Series in Microwave and Optical Engineering
1 primary work • 2 total works
Book 185
This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: Preliminary Concepts Parasitic Resistances, Capacitances, and Inductances Interconnection Delays Crosstalk Analysis Electromigration-Induced Failure Analysis Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
Recent advances in very large scale integrated (VLSI) circuit technology have resulted in complex chips with millions of interconnections packed onto a single chip. This causes many problems, including unwanted capacitances, inductances, cross-talk and propagation delays, all of which have serious effects on processor performance. This text is devoted solely to the modelling, analysis and computer simulation of high-speed VLSI interconnections. Source codes of several computer programs for simulating VLSI interconnections and challenging exercises are included at the end of each chapter.