Series:

Smart Sensors, Measurement and Instrumentation

2 primary works

Book 18

Cover of Microsensing Networks for Sustainable Cities
This book explores the microsensing technologies and systems now available to monitor the quality of air and water within the urban environment and examines their role in the creation of sustainable cities against the background of the challenges posed by rapid urbanization. The opening section addresses the theoretical and conceptual background of microsensing networks. The coverage includes detailed description of microsensors, supported by design-specific equations, and clear explanation of the ways in which devices that harvest energy from ambient sources can detect and quantify pollution. The practical application of such systems in addressing environmental impacts within cities and in sustainable urban planning is then discussed with the aid of case studies in developing countries. The book will be of interest to all who wish to understand the benefits of microsensing networks in promoting sustainable cities through better delivery of information on health hazards and improved provision of data to environmental agencies and regulatory bodies in order to assist in monitoring, decision-making, and regulatory enforcement.

Book 34

Cover of Systems-Level Packaging for Millimeter-Wave Transceivers

This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.