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STRUCTURAL PACKAGE DESIGN is a unique step-by-step manuals, containing hundreds of great folding ideas and ready-to-use designs. This book is an essential tool for anyone involved in the fields of graphic and industrial design, advertising, and printing. All patterns are stored in eps vector format on the enclosed CD-ROMs. They may be used freely to create new designs, and can be scaled and modified to suit any conceivable packaging need.

The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.Heat Transfer: Thermal Management of Electronics details how engineers can use

Modified Atmosphere Packaging for Fresh-cut Fruits and Vegetables provides comprehensive coverage of all aspects of modern MAP technologies for fresh-cut fruits and vegetables. Coverage begins with the general MAP concept and application by introducing the concept of MAP, how MAP works for fresh-cut produce and the benefits and shortfalls of MAP in its application. The book then discusses the basic aspects of MAP - packaging materials and machinery. In these sections, the book addresses not only...

Food packaging performs an essential function, but packaging materials can have a negative impact on the environment. This collection reviews bio-based, biodegradable and recycled materials and their current and potential applications for food protection and preservation. Beginning with an examination of the latest advances in bio-based food packaging materials, this book discusses the factors involved in choosing alternative packaging materials such as consumer preference, measuring the envir...

The proof is in the packaging...at the final destination! If the burden of proof is on you, Transport Packaging is the resource you need to make your case at the end of the line! Written by transportation packaging expert, Alfred H. McKinlay, Transport Packaging is geared toward ALL packaging professionals whose job responsibilities encompass transportation and distribution packaging. Transport Packaging covers: background information on the requirements and uses of transport packaging o the...

The complete and authoritative guide to modern packaging technologies -updated and expanded From A to Z, The Wiley Encyclopedia of Packaging Technology, Third Edition covers all aspects of packaging technologies essential to the food and pharmaceutical industries, among others. This edition has been thoroughly updated and expanded to include important innovations and changes in materials, processes, and technologies that have occurred over the past decade. It is an invaluable resource for packag...

The leading book on packaging and the environment-now expanded and updated This is a detailed examination and objective analysis of all aspects of environmental problems related to packaging: resource depletion, pollution, solid waste management, recycling, degradability, package design considerations, and legislation. The author is a leading authority on the subject. The presentation is well documented and non-partisan. This new edition is expanded and completely updated.

Packaging plays an essential role in protecting and extending the shelf life of a wide range of foods, beverages and other fast-moving consumer goods. There have been many key developments in packaging materials and technologies in recent years, and Trends in packaging of food, beverages and other fast-moving consumer goods (FMCG) provides a concise review of these developments and international market trends. Beginning with a concise introduction to the present status and trends in innovations...

The consumer packaged goods (CPG) industry is dominated by major Western brands. The dominance of such major brands extends to burgeoning Asian markets. These conglomerates often rely on packaging as a strategic tool to entice Asian consumers. This book illustrates how packaging as a marketing tool is more than simply changing the label or translating the brand into vernacular language. It examines how different packaging elements (e.g. information, imagery, packaging type) can help to communica...

NEW! A comprehensive and up-to-date source of evaluated properties for a wide variety of materials used for semiconductor device packaging. The "Microelectronics Packaging Materials Database" provides the semiconductor packaging engineer with a comprehensive and up-to-date source of evaluated properties for a wide variety of materials used for semiconductor device packaging. Since materials play a strong role in packaging design, manufacturability, performance, reliability and cost, this databas...

Solve your bearing design problems with step-by-step procedures and hard-won performance data from a leading expert and consultant Compiled for ease of use in practical design scenarios, Hydrostatic, Aerostatic and Hybrid Bearing Design provides the basic principles, design procedures and data you need to create the right bearing solution for your requirements. In this valuable reference and design companion, author and expert W. Brian Rowe shares the hard-won lessons and figures from a lif...

With electromagnetic compliance (EMC) now a major factor in the design of all electronic products, it is crucial to understand how electromagnetic interference (EMI) shielding products are used in various industries. Focusing on the practicalities of this area, Advanced Materials and Design for Electromagnetic Interference Shielding comprehensively

Let us suppose for a moment that paper were to disappear. Would anything be lost' Everything would be lost. aper surrounds us. Not only as books, letters and diaries, but as beer mats and birth certificates, board games and business cards, fireworks and flypaper, photographs and playing cards, tickets and tea bags. We are paper people. But the age of paper is coming to an end. E-books regularly outsell physical books. E-tickets replace the paper variety. Archives are digitized. The world we know...