This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
- ISBN10 0387765344
- ISBN13 9780387765341
- Publish Date December 2008
- Publish Status Active
- Publish Country US
- Imprint Springer-Verlag New York Inc.
- Format eBook
- Pages 364
- Language English