Wirebonding in Microelectronics Packaging

by R.R. Tummala, E.J. Rymaszewski, A.G. Klopfenstein, Eugene J Rymaszewski, and Alan G Klopfenstein

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  • ISBN10 0412154811
  • ISBN13 9780412154812
  • Publish Date 1 March 1998
  • Publish Status Out of Print
  • Out of Print 31 July 2009
  • Publish Country GB
  • Imprint International Thomson Publishing Services
  • Format Hardcover
  • Pages 159
  • Language English