Reviewing a critical issue for optical communications technologies, Component Packaging in Optoelectronics provides an overview of the history and current state of the art of fiber optic communications systems. This book presents a toolkit consisting of fundamental optics, fiber technology and interconnects, fundamentals of optoelectronic packaging, and optoelectronic chip fabrication. It covers common enabling components in detail, emphasizing the golden thread that relates individual photonic chip type and characteristics with packaging needs. With practical examples, this text also offers a comprehensive treatment of the state-of-the-art manufacturing processing in current use.
- ISBN10 0824726855
- ISBN13 9780824726850
- Publish Date 15 December 2006
- Publish Status Withdrawn
- Out of Print 5 June 2021
- Publish Country US
- Publisher Taylor & Francis Inc
- Imprint CRC Press Inc
- Format Hardcover
- Pages 300
- Language English