Dealing with BGA, CSP, flip chips and other new technologies that underlie the electronics industry's need for smaller, faster products, this text explains the fundamentals of solder joint reliability and presents creative, robust packaging techniques for cost-effective interconnection.
- ISBN13 9780070366480
- Publish Date 31 December 1996
- Publish Status Out of Print
- Out of Print 4 August 2016
- Publish Country US
- Publisher McGraw-Hill Education - Europe
- Imprint McGraw-Hill Professional
- Format Hardcover
- Pages 408
- Language English